xMEMS Ultrasonic Coolers for Power Hungry Transceivers

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In data centers, visual transmission and reception devices convert electronic bits to photons, transport them all over the room, then return them to electronic signals, making them Linchpin technological to control a snowstorm of data used in artificial intelligence. But technology consumes a lot of strength. At a data center containing 400,000 graphics processing units, NVIDIA estimates that visual transmission and reception devices burn 40 megawatts. At the present time, the only way to deal with all this heat is the hope of contact thermallyThis transmission and reception to the condition of the switch and cooling system. Thomas Tarter, the main heat engineer at XMEMS LABS, says it is not a great solution, but since these levels of transmission and reception are the size of the accumulated USB stick, there is no way to install a traditional cooling fan in each of them.

Now, XMEMS says it has adapted to the upcoming electromic mechanical (MEMS) (MEMS) (MEMS) (MEMS) (MEMS) (MEMS) (MEMS) (MEMS) (MEMS) (MEMS) (MEMS) (MEMS) (MEMS) (MEMS) (MEMS) (MEMS) (MEMS) (MEMS) (MEMS) (MEMS) (MEMS). Tarter says that keeping DSP cold is very important for longevity. In more than $ 2000 per per per the transmission and reception device, obtaining an additional year or two years of the transmission and reception device is worth it. Cooling should also improve the safety of transmission and reception signals. The unreliable links are blaming the long -length training for new large language models.

XMEMS cooling technology finds a new home

XMEMS chips technology, which was The veil was revealed in August 2024Depending on the previous product of the company, Microspeakers, the solid state of the ear headphones. Electrical materials that can change the shape at ultrasound frequencies are used to pump 39 cm of air per second through a slice of about about a millimeter and less than a centimeter on the side.

The smartphones, which were very small to carry a fan, were the first clear texture applicationCold, but artificial intelligence systems cooling rapidly growing data appears to be a long -to -reach technology, because it cannot approach liquid cooling systems that remove thousands of heat from GPU servers.

“We were surprised by the pleasure of the data center customer approach,” says Mike Housholder, the owner of Housholder, Vice president of Marketing at XMEMS. “We focused on low strength. So we didn’t think we have peace without you.”

Translatable visual transmission and receptions turn into a data center technology that is directly present at the Wheel-AN-ACIP home. Today, the heat is connected from the DSP from the transmission and reception device, the X -vision and thermal IC, with the network key devices that are connected to it. (This usually sits at the top of the computers shelf.) Then it removes the air that moves over the built -in fins in the face of the heat key.

In cooperation with the partners who will not mention, XMEMS began to explore how the air flows through the transmission and reception device. These parts consume 18 watts or more. But by placing the company’s MEMS chip inside the air flow channel, the thermal connected to the transmission and reception chips, but it is physically isolated from it, the company expects that it will be able to drop the DSP temperature by more than 15 percent.

The homeowner says that XMEMs make MEMS chips at the nanopolitan evaluation facility in Stanford, but will get the first Silicone production from TSMC in June. The company expects to be in full production in the first quarter of 2026. “This corresponds to well with our first customers,” he says.

Records and reception shipments grow quickly, according to the Dell’oro Group. The market analyst predicts that 800 GB shipments and 1.6 of parts per second will grow by more than 35 percent annually until 2028. Other innovations in visual communications that can affect heat and energy also in stopping. In March, Broadcom has unveiled a new DSP that can reduce energy by more than 20 percent for the 1.6TB/s reception device, partly due to the use of a more advanced chip process. The last company and NVIDIA have developed the keys to separate networks that completely get rid of transmitters and receptions. These new “packed optics” optical/e -conversion on the silicone within the Switch Chip package.

But Tarter, who has been working on cooling chips since the 1980s, is expected to be more applications inside and outside the Data Center to buy MEMS. “We are learning a lot about applications,” he says. “I have reached 20 or 30 basic applications for that, and we hope that designers will inspire them to say” Oh, so I can use this in my system. “

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